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ICs should have longer leads

Started by icecycle66, December 12, 2012, 08:35:20 PM

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icecycle66

If integrated circuits had longer leads, we could stand them vertically and save more space in layouts.

China, get on this.

JakeFuzz


icecycle66

Good start. But how about a 4x4 vertically oriented.  Then you could keep the linear length the same and save up to a whole millimeter in width.

JakeFuzz

Mmm I see what you mean. I think the wire bonding from the die to the package leads would be weird. Everything in the SILP and DILP are planar so the bonder tip just moves in the plane of the pads. To keep it planar in the case you are thinking there would need to be additional routing from the bonding pads to the leads on the underside of the die. There probably isn't enough incentive to design or build a package like that. You could also mount the die face up but then everything would be really small to bond to and the pads may not fit. I agree though it would be nice.

davent

"If you always do what you always did- you always get what you always got." - Unknown

If my photos are missing again... they're hosted by photobucket... and as of 06/2017 being held hostage... to be continued?

wgc

Google bga (ball grid arrays) and flip chip ic's.  You won't get much tighter layouts than those.
always the beautiful answer who asks a more beautiful question.
e.e. cummings